ReWork SMT/BGA Liquid Flux 125mL

Description

For repairing (SMT/BGA) chipset solder balls, soldering and reballing of chipset for PCs, laptops, smartphones and all sensitive electronic components by using tin soldering iron, hot air soldering station and SMT/BGA rework station.Features:– Quick repairing of oxidized solder balls for chipset without lifting.– Fast reflow and evenly spread under (BGA) chipset.– High quality and activity.– Non conductive, non corrosive and fungus resistant.– No residue after rework and easy cleaning.Usage:This flux can be used in both automated and manual soldering applications, it is great for general purpose soldering of electronic boards, wires, semiconductors and SMD/SMT/BGA.It is also deal for solder coating or tinning leads, it may be applied by spray, or foam for tin soldering applications.Usage Recommendations:– Clean the surface (Clear any residues or dust).– Put a little bit of flux.– Use soldering iron with soldering wick.– Use hot air soldering station for (SMT) ICs rework at (max180°C).– Use thinner or any alcohol for cleaning.Notes:– Not suitable with dip or wave soldering.– Not suitable with welding by fusion or flame.Safety Precautions:– Close after using & keep away from children.– Use enough water when eyes or wounds are touched.Appearance: The flux is a light yellow liquid, packaged in a plastic bottle – (Net Capacity) 125mL.Thanks for Your Trust