M&R Solder Paste Soldering Tin Cream For PCB BGA SMD 42gm (XGSP50)

Description

Features:Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on Good soldering and welding toolSpecification:Material: Plastic+solder pasteType: XGSP50Alloy: Sn63/Pb37Microns: 3#Weight : 42gmApplication:Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.