Metallic Solder Paste 185-235? Sn63-Pb37 15g

Description

Metallic Solder Paste 185-235°C Sn63-Pb37 15g is a high-quality electronic component designed for Arduino, prototyping, and educational electronics. Solder Paste 15g for PCB/SMD/BGA/PGA Solder Paste for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station. Specifications: Particle Size:30-45 Micron Alloy: Sn63/Pb37 Melting Point: 185-240 Celsius Features: Suitable to stencil printing (holes larger than 0.45mm). Good conductivity and oxidation resistance. High purity and soft soldering. Bright and full solder joints. No residue solid after rework and easy cleaning. Halogen free. Usage: Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances. Reballing BGA chipset with reballing stencil (holes larger than 0.45mm). Repairing phones, as well as replacement SMD component, micro switches and charging connectors. Soldering electrical control boards. Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips. Usage Recommendations (very important): Follow safety precautions & notes. Clean the surface (Clear any residues or dust). Put a very little bit of solder paste before soldering. Use a suitable soldering iron tip with the target area. Use a suitable soldering iron with the target size. Us